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Please use this identifier to cite or link to this item:
http://hdl.handle.net/2328/8600
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| Title: | Near-zero-thickness self-assembled molecular
layers for future device structures: interfacial adhesion and diffusion barrier
properties |
| Authors: | Ganesan, P G
Cui, G
Ellis, Amanda Vera
Kane, R S
Ramanath, G |
| Issue Date: | 2003 |
| Publisher: | Trans Tech Publications |
| Citation: | Ganesan, P.G., Cui, G., Ellis, A.V.,
Kane, R.S., & Ramanath, G., 2003. Near-zero-thickness self-assembled molecular
layers for future device structures: interfacial adhesion and diffusion barrier
properties. THERMEC 2003 International Conference: processing and manufacturing of
advanced materials, 426-432(4), 3487-3492. |
| URI: | http://hdl.handle.net/2328/8600 |
| ISBN: | 02555476 |
| Appears in Collections: | 0299 - Other Physical Sciences
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