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Please use this identifier to cite or link to this item: http://hdl.handle.net/2328/8600

Title: Near-zero-thickness self-assembled molecular layers for future device structures: interfacial adhesion and diffusion barrier properties
Authors: Ganesan, P G
Cui, G
Ellis, Amanda Vera
Kane, R S
Ramanath, G
Issue Date: 2003
Publisher: Trans Tech Publications
Citation: Ganesan, P.G., Cui, G., Ellis, A.V., Kane, R.S., & Ramanath, G., 2003. Near-zero-thickness self-assembled molecular layers for future device structures: interfacial adhesion and diffusion barrier properties. THERMEC 2003 International Conference: processing and manufacturing of advanced materials, 426-432(4), 3487-3492.
URI: http://hdl.handle.net/2328/8600
ISBN: 02555476
Appears in Collections:0299 - Other Physical Sciences

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